Toppan Inc. Showcases Advanced Semiconductor Solutions at JPCA Show 2025

Reuters
2025.05.28 01:04
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Toppan Inc., a subsidiary of TOPPAN Holdings Inc., will participate in JPCA Show 2025 from June 4 to 6 at Tokyo Big Sight. The event will showcase advanced semiconductor solutions, including FC-BGA substrates that enhance LSI chip performance for generative AI and communication devices. Toppan will also present next-generation packaging technologies using glass and organic materials, highlighting their commitment to innovation in the electronics industry.

TOPPAN Inc., a subsidiary of TOPPAN Holdings Inc., is set to participate in JPCA Show 2025 at Tokyo Big Sight from June 4 to 6. The event will highlight cutting-edge technologies in the electronic circuit sector, and TOPPAN will showcase its latest advancements in semiconductor packaging. At the forefront of their presentation will be FC-BGA substrates, which enhance speed and functionality for LSI chips, crucial for generative AI and communication devices. Additionally, TOPPAN will display next-generation semiconductor packaging technologies, emphasizing innovations using glass and organic materials to support higher integration and transmission capabilities. These efforts underline TOPPAN's commitment to advancing the electronics industry.

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