RML denies rumors of cooperation with Huawei and SMIC

Zhitong
2025.06.05 01:12

According to online news, there have been rumors recently that RML is collaborating with Huawei to develop a 28GHz millimeter-wave radio frequency front-end module, and is working with Semiconductor Manufacturing International Corporation (SMIC) to develop a 22nm FDSOI process PDK, with plans to enter mass production this year for satellite communication and mobile phone chips. In response, RML stated that the company is currently not collaborating with the aforementioned two companies

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