Hiecise: The first ultra-precision curved surface grinding machine has been produced and delivered for customer verification

Hiecise announced the release of the investor relations activity record form, stating that the company's ultra-precision curved surface grinding machine is aimed at key application fields such as industrial mother machines, semiconductors, military industry, and aerospace, mainly used for ultra-precision optical components, ultra-precision flat parts, and ultra-precision grinding processing of semiconductor precision components. The first ultra-precision curved surface grinding machine has been completed and delivered to the customer for verification. The business cooperation with Fuliwang is currently progressing in accordance with the contract, with the first batch of equipment scheduled for delivery in September