
Prisemi plans to acquire 100% equity of Jishun Technology and 17.15% equity of Shunlei Technology to achieve 100% control over Shunlei Technology

Prisemi plans to acquire 100% equity of Jishun Technology and 17.15% equity of Shunlei Technology through the issuance of convertible corporate bonds and cash payment, with a total transaction price of approximately 403 million yuan. This move will enable Prisemi to achieve 100% control over Shunlei Technology, enhancing its technological barriers and competitiveness in the power semiconductor field. Both parties have synergistic effects in product lines and market areas, which are expected to improve customer service capabilities and expand market share
According to the Zhitong Finance APP, Prisemi (688230.SH) announced that the listed company plans to issue convertible corporate bonds to Shengfeng, Li Hui, Huang Song, Wang Qingsong, and Shunlei Youcai, as well as pay cash to acquire 100% equity of Jishun Technology and 17.15% equity of Shunlei Technology, thereby directly and indirectly holding 100% equity of Shunlei Technology and achieving 100% control over Shunlei Technology. The transaction price is tentatively set at 403 million yuan.
The target company and the listed company both belong to the power semiconductor industry, having deep expertise in power devices for many years and able to provide a full range of circuit protection solutions. The two parties have high business synergy, and their advantageous product lines (automotive-grade power semiconductor products and industrial-grade power semiconductor products, etc., covering TVS, ESD protection devices, MOSFETs, Schottky diodes, etc.) can achieve deep complementarity, jointly building a comprehensive power semiconductor solution platform that covers a wider range of application scenarios and more complete technical specifications. This will significantly enhance the ability to meet customers' diverse and high-performance needs. At the same time, through the integration of R&D resources and sharing of core technologies, both parties are expected to generate synergies in device design, process optimization, and packaging technology, accelerating technological innovation iteration and jointly enhancing the technological barriers and core competitiveness in the power semiconductor field.
Through this transaction, the core products of the target company can further improve the listed company's layout in power semiconductors and enrich its product system. The target company has established a solid customer base and sales channels in multiple downstream application fields such as automotive electronics, security instruments, civil explosive chemicals, and industrial sectors. The listed company's current advantages are concentrated in the consumer electronics field represented by smartphones, and this transaction will create a significant market synergy effect.
Through this transaction, the listed company can leverage the target company's high-quality customer resources to enter multiple fields such as automotive electronics, security instruments, civil explosive chemicals, and industrial sectors. The target company can also leverage the listed company's market channels and customer resources to consolidate and strengthen its layout in industrial sectors while expanding its market share in the consumer electronics field. In terms of supply chain management, leveraging the listed company's years of high-quality supply chain management experience and the target company's production capacity will benefit both parties in improving product quality, production efficiency, and cost-effectiveness. At the same time, the target company has its own wafer and packaging production lines, which will help the listed company strengthen its supply chain management control capabilities, enhance product capacity and supply quality, benefiting the overall strategic layout and implementation of the listed company while expanding overall sales scale and enhancing market competitiveness

