Pan Asian Microvent: Plans to raise no more than 699 million yuan through a private placement

Pan Asian Microvent announced that it plans to raise no more than 699 million yuan through a private placement. The net proceeds from the fundraising, after deducting issuance expenses, will be used for the CMD product intelligent manufacturing technology transformation and expansion project, the industrialization project of low dielectric loss FCCL flexible copper-clad laminates for 6G communications, the construction project of the research and development center, and to supplement working capital. The number of shares to be issued in this offering will not exceed 27.3 million shares