SINOPACK: The silicon carbide chip wafer process line is in the product upgrade and customer introduction stage

SINOPACK released the investor relations activity record form. In the first half of 2025, the silicon carbide chip wafer process line will be upgraded from 6 inches to 8 inches, and it is currently in the product upgrade and customer introduction stage. The new product development of ceramic components has achieved phased progress, having passed verification on domestic semiconductor equipment and achieved mass supply. The company's optical communication device shell transmission rates have covered 2.5Gbps, 10Gbps, 25Gbps, 100Gbps, 200Gbps, 400Gbps, 800Gbps, and 1.6Tbps, all of which have achieved mass production. The company is currently actively cooperating with customers in the research and development of 3.2Tbps products. In addition, the company's aluminum nitride multilayer thin and thick film products have achieved rapid growth, with applications in high-frequency and high-speed optical modules, and are being used in new scenarios such as AI intelligence and data centers