SSNGY

INTC

SOXL

<p>CPO (Co-Packaged Optics) technology will reshape the external bandwidth of AI data centers, significantly increasing data transmission speeds and reducing power consumption. Silicon photonics technology is advancing rapidly, and a complete ecosystem has formed in the industry chain. Foundries, chip giants, and server manufacturers are all accelerating their layout of CPO technology, engaging in fierce competition. Companies such as Taiwan Semiconductor, Intel, and Samsung are actively positioning themselves in this field to compete for market dominance</p>

- CPO (Co-Packaged Optics) technology is set to revolutionize external bandwidth in AI data centers by significantly enhancing data transfer speeds and reducing power consumption.  
- The industry is witnessing rapid advancements in silicon photonics, with over 150 companies forming a diverse ecosystem, and major players like TSMC, Intel, and Samsung intensifying their efforts in this field.  
- As CPO technology approaches commercialization in 2027, the competition among foundries, design service providers, and chip manufacturers will shape the future of AI computing infrastructure.

CPO Harvest Battle, Fully Launched