HENGHUI Technology Corporation Limited engages in the research, development, manufacture, and sale of integrated circuit (IC) card packaging frames and module products primarily in China. It offers contact, contactless, dual interface, gold-plated, palladium-plated, and other IC card packaging frames and module products; IC card substrates; etched metal lead frames; and wafer thinning and scribing services. The company’s products have applications in the fields of telecom, banking, mobile payment, military, aerospace, social security, health, education, transportation, logistics, food, public safety, etc. It also sells its products in the European Union, Southeast Asia, Russia, Africa, South America, and other countries and regions.