JCET Group Co., Ltd., together with its subsidiaries, provides integrated-circuit manufacturing and technology services in China and internationally. The company offers semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipment solutions; wirebond packaging, flip chip packaging, wafer bumping, wafer level packaging, system-in-package, MEMS and sensors packaging, power device packaging, and fan-in and out wafer-level packaging. It also provides design and characterization, test platforms, and engineering services. The company’s products are used in automotive, computing, storage, edge AI, and power and energy sector.
