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UNION SEMICONDUCTOR (HEFEI)
688403.SH
Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for integrated circuits in China. The company offers front-end gold bumps, wafer bumps, wafer testing, back-end chip-on-glass packaging, film-on-chip packaging, tape and reel chip package, and turnkey packaging and testing services for driver integrated circuits. Its products are used in TVs, laptops, mobile phones, tablets, digital cameras, and other consumer electronics.
6.219 T
688403.SHMarket value -Rank by Market Cap -/-

Financial Score

08/11/2025 Update
B
SemiconductorsIndustry
Industry Ranking43/163
Industry medianC
Industry averageC
Score Analysis
Peer Comparison
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    Rating
  • Profit ScoreC
    • ROE5.54%C
    • Profit Margin10.61%B
    • Gross Margin22.92%D
  • Growth ScoreB
    • Revenue YoY22.17%A
    • Net Profit YoY18.36%B
    • Total Assets YoY6.50%B
    • Net Assets YoY10.67%B
  • Cash ScoreB
    • Cash Flow Margin942.47%B
    • OCF YoY22.17%A
  • Operating ScoreC
    • Turnover0.37C
  • Debt ScoreB
    • Gearing Ratio28.25%B

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