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Powertech, Taiwan’s 2nd biggest semiconductor packaging firm, will more than double 2026 capex to over NT$40 billion (US$1.3 billion), from NT$19 billion this year, media report, adding US$1 billion i...............

Winbond Electronics approved a new NT$35.59 billion capex budget (US$1.2 billion) to expand memory chip manufacturing capacity in Taiwan, up from NT$5.3 billion early this year, media report. The memo...............